Liquid Silicone Electronic Potting Compound For Led Encapsulation Rubber
Product Description
Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component B is black for easy identification and inspection of complete mixing.(colors can be adjusted as per customer requirement.) When the components are thoroughly mixed in a 1:1 ratio by weight or volume, the liquid mixture cures to a flexible elastomer, which is suited for electrical/electronic potting and encapsulating applications.
Applications
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and electronic components, etc.
Features
Silicone compound has a excellent electrical property features in resistant to temperature, corrosion, radiation, insulation, waterproof, damp proofing, shock resistance, thermal conducting, inflaming retarding and weather ability, etc. It can be long-term used under -50℃～200℃.
Technical datasheet of Electronic Potting Silicone Encapsulates
| Item No. | RTV160 |
| Before curing |
| Appearance | A: brick red B: transparent |
| Viscosity (mPa.s 25°C) | 3000~6000 |
| Density (g/cm3 ) | 1.57±0.02 |
| Working life (min 25°C) | 30 |
| Curing time (hrs) | 24 |
| Heat-up at 100°C (min) | 10 |
| After curing |
| Hardness (shore A) | 50~60 |
| Dielectric breakdown voltage kv/mm 25°C | ≥20 |
| Volume resistivity ohm*cm | 1*1015 |
| Tensile Strength Mpa | ≥0.6 |
| Thermal conductivity cm/°C | 0.525*10-3 |
| Working temperature °C | -30~200 |
Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.
Thermal expansion properties
The coefficient of thermal expansion ranging of silicone compound is 5.9-7.9 x 10-4/°C. The coefficient of linear thermal expansion is about 1/3 of the coefficient of volume thermal expansion; it can be used for the overall linear thermal expansion calculation of rubber parts under a certain limits of temperature.
Curing time
The following cure schedules may be used as a guideline; however, larger masses may require longer periods of time to reach temperature.
24 hours at 23-25℃
4-6 hours at 50℃
1-2 hours at 100℃
Faster if needed
25-30 mins at 60℃
18 mins at 70℃
5 mins at 80℃
Using Instructions
Silicone compound part A and Part B should be thoroughly mixed at a 1:1 ratio (weight or volume) before using. Pour into the electronic components after vacuum de-airing. Silicone compound may be cured at room temperature or accelerated with heat.
Precautions
- The curing time varies due to different temperature, the higher temperature, it cures faster. Users can adjust the ratio of catalyst according to the temperature in order to get an ideal curing speed.
- Certain materials can inhibit the cure of Silicone rubber. The most notable include: sulfur, polysulfide, sulfur-containing material, Organ tin and organ metallic compound, etc.
- Prevent from contact with tin, phosphorus, water, ammonium, chlorine, carboxylic acid, hydroxyl compound, etc. to avoid un-curing circumstance.
Packing and Storage
- Silicone rubber is shipped as kits that Part A and B liquid components in separate containers. It is available in packing in 5kg or 20kg per pail.
- Silicone rubber must be tightly sealed in cool and dry place, prevented from sun and rain. Transport by non-dangerous goods.
Storage & Transportation of Electronic Potting Silicone Encapsulates
Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
It can be stroked and transported as non-dangerous goods.
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4000cps Waterproof Led Encapsulation Silicone Potting Compounds For Electronics Images
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